DIE BONDER
芯片贴装机是一种能够将芯片或芯片板安装到最大尺寸为 600mm x 600mm 的基板上的设备
核心技术
- High resolution optic system
- Precise motion control stage
- Reliable pick and place system
- Supporting face up and face down mode
工艺介绍
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Die Attach : 将晶圆切割后的芯片贴装到基板上.
Plate Mounting : 将玻璃等平板材料贴装到基板上.
SPEC
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Chip Size : 0.5x0.5 ~ 25x25
Plate Size : 50x50 ~ 150x150
Chip Accuracy 3σ < 2.5㎛
Plate Accuracy 3σ < 7.0㎛
适用领域
Die attatch for large substrate
Plate embedding for large substrate